Scope shown for online ordering
Reference price range: USD 80,000 – 400,000 (per die bonder). Final quotation depends on specification, materials and order quantity — contact us for details.
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Available for direct purchaseItem SEM-002
Semiconductor Packaging & Testing Equipment
Die Bonder — high-speed precision die attach system; automatic wafer handling; epoxy dispensing; vision alignment; 300 mm wafer compatible.
原价为：$80,999.00。$79,999.00当前价格为：$79,999.00。
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